Thin-film circuit ceramic packaging substrates are widely used in 5G RF front-end discrete devices and module packaging due to their high reliability, high thermal conductivity, high circuit resolution, high circuit flatness, and excellent noise reduction and anti-interference capabilities.
Model:
5555Material:
Alumina/aluminum nitrideSubstrate Thickness:
1.1±0.15 mmNumber Of Typeset:
4 pcs/sheetSheet Size:
114.6×114.6 mmSingle Size:
53.5×53.5 mmMinimum Line Width:
0.20 mmGap Size:
0.10 mmMinimum Aperture:
0.07 mmCopper Thickness:
50±15 μmDam Thickness：
400±50 μmStep Height：
40±15 μumBoss Copper Thickness：
40±15 μmMetal Column High:
