Thin-film circuit ceramic packaging substrates are widely used in 5G RF front-end discrete devices and module packaging due to their high reliability, high thermal conductivity, high circuit resolution, high circuit flatness, and excellent noise reduction and anti-interference capabilities.
Model:
1919Material:
Aluminum nitrideSubstrate Thickness:
0.51±0.05 mmNumber Of Typeset:
10 pcs/sheetSheet Size:
109.0×109.2 mmSingle Size:
19.3×19.3 mmMinimum Line Width:
0.20 mmGap Size:
0.15 mmMinimum Aperture:
0.07 mmCopper Thickness:
65±15 μmDam Thickness：
Step Height：
Boss Copper Thickness：
Metal Column High:
