Thin-film circuit ceramic packaging substrates are widely used in 5G RF front-end discrete devices and module packaging due to their high reliability, high thermal conductivity, high circuit resolution, high circuit flatness, and excellent noise reduction and anti-interference capabilities.
Model:
2016Material:
Alumina/aluminum nitrideSubstrate Thickness:
0.52±0.05 mmNumber Of Typeset:
2478 pcs/sheetSheet Size:
109.2×109.2 mmSingle Size:
2.0×1.6 mmMinimum Line Width:
0.10 mmGap Size:
0.10 mmMinimum Aperture:
0.07 mmCopper Thickness:
Dam Thickness：
Step Height：
Boss Copper Thickness：
40±15 μmMetal Column High:
