OUR PRODUCTS

Thin-film circuit ceramic packaging substrate is a technology combining the film metallization and electroplating process of thin film:Namely according to the application requirements, 2D metal circuits are fabricated on high thermal conductive ceramic substrates by means of film metallization and image transfer. Then TCV(Through Ceramic Via) technology is used to form a vertical interconnection between double-sided wiring, and finally stacking technology is used to obtain an integrated 3D metal frame which is tightly bound to the ceramic substrate.

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ABOUT US

Jiangxi lattice grand advanced material technology co., ltd. was founded in July 2020. The company is located in Intelligent Photoelectric Industrial Park, Third Xianghe Road,Linkong Economic Zone, Nanchang, Jiangxi Province. It covers an area of about 10,000 square meters and has more than 100 employees, including more than 40 bachelor's degree holders. It is a thin film circuit ceramic substrate manufacturer with research and development, manufacturing and sales. The company has a self-trained professional technology research and development team, advanced production management system, systematic decision-making process, committed to providing fast, professional and cost-effective products and perfect solutions for global customers.

The company's main product is a based film circuit packaging process of high thermal ceramic packaging substrate. Namely, film metallization, image transfer and TCV(Through Ceramic Via) technology are adopted in ceramic substrates with high heat conduction the formation of high density double sided wiring and vertical interconnection, finally, the stacking technique is used to obtain an integrated 3D metal frame which is tightly bound to the ceramic matrix. The company's products conform to the semiconductor device miniaturization, integration, high heat dissipation, airtightness, self-shielding and other packaging requirements. It is the ideal packaging substrate for semiconductor lighting, power electronics, optoelectronics, microwave radio frequency and other fields.

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